210 μm×210 μm超大像元 TDICCD电荷输运技术
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(1.重庆光电技术研究所,重庆 400060;2.湖南大学物理与微电子科学学院,长沙 410082)

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杨洪(1982—),正高级工程师,主要从事 CCD器件的设计研究工作。

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TN386. 5

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Research on Charge Transport Technology of 210 μm×210 μm Ultra-large Pixel TDICCD
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(1. Chongqing Optoelectronics Research Institute,Chongqing 400060,CHN;2. College of Physics and Microelectronics,Hunan University,Changsha 410082,CHN)

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    摘要:

    针对深空探测、低照度航天遥感等领域对超高灵敏度成像器件的需求,文章围绕超大像元时间延迟积分电荷耦合器件(TDICCD)的电荷输运技术开展了研究。所研制的器件像元尺寸达 210 μm×210 μm,是国内外首次研制的同类超大像元 CCD,设计满阱容量大于 10 000 ke.,其核心技术瓶颈在于如何在有限的行周期与积分时间内实现超大电荷量的高效转移与读出。针对该瓶颈,提出一种 “垂直 CCD细分 -垂直 CCD求和 -水平 CCD细分 -输出节点求和 ”的新型器件架构。该架构通过细分垂直与水平 CCD多晶硅栅,将单一大电荷包拆分为多份小电荷包并行转移,在保持驱动脉冲数不变的前提下,大幅缩短了大电荷量的转移时间,最终通过求和势阱实现信号的合并还原。基于该架构完成了器件的设计与工艺实现,测试结果表明,器件满阱容量达 17 895 ke.,单级电荷转移效率优于 99. 999%,有效解决了超大像元 TDICCD的电荷转移难题,为超高灵敏度 TDICCD的研制提供了全新的技术路径。

    Abstract:

    To address the demand for ultra-high sensitivity imaging devices in deep space detection,low-illumination space remote sensing,and other fields,this study investigated the charge transport technology of a 210 μm×210 μm ultra-large pixel Time Delay and Integration Charge Coupled Device(TDICCD). The pixel size of the device is 210 μm×210 μm,which is the first such ultra-large pixel CCD developed worldwide,with a designed full well capacity greater than 10 000 ke.. The core technical bottleneck is how to achieve efficient transfer and readout of ultra-large charge packets within the limited line period and integration time. This study proposes a novel device architecture of vertical CCD subdivision-vertical CCD summation-horizontal CCD subdivision-output node summation. By subdividing the polysilicon gates of the vertical and horizontal CCDs,a single large charge packet is split into multiple small charge packets for parallel transfer. By keeping the number of driving pulses unchanged,the transfer time of the large charge packet is greatly shortened,and the signal is merged and restored through the summation potential well. Device design and process implementation were completed based on this architecture. Test results show that the full well capacity of the device reaches 17 895 ke .,and the single-stage charge transfer efficiency is greater than 99. 999%,which effectively solves the charge transfer problem of ultra-large pixel TDICCDs and provides a new technical path for the development of ultra-high sensitivity TDICCDs.

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杨洪,彭树阳,白雪平,周亚军.210 μm×210 μm超大像元 TDICCD电荷输运技术[J].半导体光电,2026,47(4):756-762. YANG Hong, PENG Shuyang, BAI Xueping, ZHOU Yajun. Research on Charge Transport Technology of 210 μm×210 μm Ultra-large Pixel TDICCD[J].,2026,47(4):756-762.

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  • 收稿日期:2026-03-26
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  • 在线发布日期: 2026-08-25
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