The heat dissipation characteristics and the temperature field of high power semiconductoe laser module were studied through the numerical simulation analysis. The effects of the parameters of solder, heat sink, heat conduct glue and water-cooling plate temperature on the highest temperature of chip were analyzed. The results show that when the solder thickness is less than 24μm, the thermal conductivity of solder has less impact on the highest temperature of chip and no high resistance layer will be formed. The highest temperature of chip decreases in an exponential form with the increases of the length and width sizes and thermal conductivity of heat sink, while increases in an exponential form with the increases of the heat sink thickness. When the thermal conductivity of heat conduct glue is more than 20W/(m·K) and its thickness is less than 30μm, the temperature of chip becomes stable. The relationship between the water-cooling plate temperature and the highest temperature of chip shows linear correlation, and the proportional coefficient is equal to 1. According to the results, the design and selection principles of size, thermal conductivity or material of semiconductor laser packaging parts are proposed.