The effects of residual particles on wafer bonding were analyzed, and then, a bonding criterion was proposed in the view of particles statics. In order to solve the problem of bubbles generated by residual particles on the surface, a new wafer bonding method, called Spot Pressing Bonding, was applied to the bonding of wafers, and then it was compared with the conventional Au-Au thermocompression bonding. The experimental results suggest that bubbles on the bonding interface can be reduced significantly by Spot Pressing Bonding.